Metallography of niobium/alumina interfaces

Journal Article · Sat Jan 01 04:00:00 EST 1983 · Microstruct. Sci.; (United States)

OSTI ID:5784190

Kelly, M D; Abernathy, M K

Niobium pins were investigated as potential electrical feedthroughs in alumina ceramic components. The pins were diffusion bound to the alumina substrates during sintering to form the feedthroughs. The resulting parts required metallography to evaluate the interfacial reactions. Metallographic techniques to properly prepare the niobium surface for analysis while maintaining the ceramic interface required etch/polish techniques to remove the disturbed metal. The interfacial reactions observed show silicon-niobium diffusion which results in a strong pin-ceramic bond.

• Research Organization: Mound Facility, Miamisburg, OH
• DOE Contract Number: AC04-76DP00053
• OSTI ID: 5784190
• Journal Information: Microstruct. Sci.; (United States), Journal Name: Microstruct. Sci.; (United States) Vol. 11; ISSN MSSCD
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
360201 -- Ceramics
Cermets
& Refractories-- Preparation & Fabrication
360202* -- Ceramics
Cermets
& Refractories-- Structure & Phase Studies
ALUMINIUM COMPOUNDS
ALUMINIUM OXIDES
CHALCOGENIDES
FABRICATION
INTERFACES
METALLOGRAPHY
NIOBIUM COMPOUNDS
NIOBIUM OXIDES
OXIDES
OXYGEN COMPOUNDS
REFRACTORY METAL COMPOUNDS
SILICON COMPOUNDS
SILICON OXIDES
TRANSITION ELEMENT COMPOUNDS
WIRES