Transport and structural properties of the top and bottom grain boundaries in YBa{sub 2}Cu{sub 3}O{sub 7{minus}{delta}} step-edge Josephson junctions
- Physics Department, Chalmers University of Technology and Goeteborg University, S-41296 Goeteborg (Sweden)
We present a method to study separately the electrical transport properties of the grain boundaries (GBs) formed at the top and at the bottom edges of YBa{sub 2}Cu{sub 3}O{sub 7{minus}{delta}}(YBCO) step-edge Josephson junctions. The step-edge junctions were fabricated on (100) LaAlO{sub 3} steps using tilted Ar ion milling to define the electrodes and the microbridges. Due to the shadowing effect of the step, a continuous YBCO stripe remains along and at the bottom of the step on both sides of a microbridge. We found that the top GB is responsible for the weak link behavior of our step-edge junctions. The transport properties were correlated with the different microstructural properties of the two GBs formed at the edges of the step. {copyright} {ital 1998 American Institute of Physics.}
- OSTI ID:
- 573723
- Journal Information:
- Applied Physics Letters, Journal Name: Applied Physics Letters Journal Issue: 2 Vol. 72; ISSN APPLAB; ISSN 0003-6951
- Country of Publication:
- United States
- Language:
- English
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