Chemistry, bonding and fracture of grain boundaries in Ni{sub 3}Si

Book · Wed Dec 31 04:00:00 EST 1997

OSTI ID:571886

Subramanian, S; Muller, D A; Silcox, J; Sass, S L ^[1]

---

1. Cornell Univ., Ithaca, NY (United States)

To obtain insight into the effect of dopants on the bonding and cohesive energy of grain boundaries in L1{sub 2} intermetallic compounds, the chemistry and electronic structure at grain boundaries in B-free and B-doped Ni-23 at % Si alloys were examined, with electron energy loss spectroscopy (EELS) providing information on the former and energy dispersive X-ray spectroscopy (EDX) on the latter. Ni-enrichment was seen at large angle boundaries, both in the absence and presence of B. EELS of the Ni L{sub 3} edge showed that the bonding at Ni-rich grain boundaries was similar in both undoped and doped alloys. Comparison of the Ni L{sub 3} edge recorded at the grain boundary and in the bulk suggests that reduced hybridization and weaker bonding occurs at Ni-rich grain boundaries in both doped and undoped alloys. These changes in bonding are interpreted in terms of changes in the cohesive energy of the boundaries.

• Sponsoring Organization: USDOE, Washington, DC (United States)
• DOE Contract Number: FG02-85ER45211
• OSTI ID: 571886
• Report Number(s): CONF-961202--
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
BINDING ENERGY
BORON ADDITIONS
ELECTRONIC STRUCTURE
EXPERIMENTAL DATA
FRACTURE PROPERTIES
GRAIN BOUNDARIES
INTERMETALLIC COMPOUNDS
METALLURGICAL EFFECTS
NICKEL BASE ALLOYS
SILICON ALLOYS