Thermal conductance of pressed contacts at liquid helium temperatures

Technical Report · Sun May 01 00:00:00 EDT 1983

OSTI ID:5718748

Salerno, L J; Kittel, P; Spivak, A L

The thermal contact conductance of a 0.4 micrometer surface finish OFHC copper sample pair has been investigated from 1.6 to 3.8 K for a range of applied contact forces up to 670 N. Experimental data have been fitted to the relation for the integral alpha T to the nth power dt by assuming that the thermal contact conductance is a simple power function of the sample temperature. It has been found that the conductance is proportional to T squared and that conductance increases with an increase in applied contact force. These results confirm earlier work.

• Research Organization: National Aeronautics and Space Administration, Moffett Field, CA (USA). Ames Research Center
• OSTI ID: 5718748
• Report Number(s): N-8327876; NASA-TM-84365
• Country of Publication: United States
• Language: English

Related Subjects

71 CLASSICAL AND QUANTUM MECHANICS
GENERAL PHYSICS
ELECTRIC CONTACTS
THERMAL CONDUCTIVITY
COPPER
CRYOGENICS
ELECTRIC POTENTIAL
SUPERCONDUCTIVITY
TEMPERATURE DEPENDENCE
ULTRALOW TEMPERATURE
ELECTRIC CONDUCTIVITY
ELECTRICAL EQUIPMENT
ELECTRICAL PROPERTIES
ELEMENTS
EQUIPMENT
METALS
PHYSICAL PROPERTIES
THERMODYNAMIC PROPERTIES
TRANSITION ELEMENTS
420201* - Engineering- Cryogenic Equipment & Devices