On eliminating deposition induced amorphization of interfaces in refractory metal multilayer systems

Conference · Wed Apr 01 00:00:00 EST 1992

OSTI ID:5715328

Jankowski, A F

Multilayer thin films with refractory metal components are susceptible to solid-state amorphization. It is an objective to minimize this interfacial reaction in order to ensure smooth layering and compositionally abrupt interfaces. These features are desirable for maximum reflectivity in x-ray optic applications as projection lithography as well as neutron supermirror applications. This goal is achievable when the deposition process is optimized to thermalize the sputtered neutrals. Low working as pressures (<5 m Torr) and large source-to-substrate distances (> 12 cm) typically provide the proper conditions to form dense sputter deposits without adatom induced, interfacial amorphization. The interfaces of Mo/Si and Ni/Ti multilayers are examined with high resolution electron microscopy for samples sputter deposited under thermalized conditions. It is shown possible to produce crystalline, refractory metal layers in the as-deposited structure without amorphous interfacial regions.

• Research Organization: Lawrence Livermore National Lab., CA (United States)
• Sponsoring Organization: USDOE; USDOE, Washington, DC (United States)
• DOE Contract Number: W-7405-ENG-48
• OSTI ID: 5715328
• Report Number(s): UCRL-JC-108820; CONF-920439-2; ON: DE92008924
• Resource Relation: Conference: International conference on metallurgical coatings and thin films, San Diego, CA (United States), 6-10 Apr 1992
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
INTERFACES
AMORPHOUS STATE
REFRACTORY METALS
DEPOSITION
ELECTRON MICROSCOPY
LAYERS
MOLYBDENUM
NICKEL
SILICON
SPUTTERING
THIN FILMS
TITANIUM
ALLOYS
ELEMENTS
FILMS
METALS
MICROSCOPY
SEMIMETALS
TRANSITION ELEMENTS
360101* - Metals &amp; Alloys- Preparation &amp; Fabrication
360102 - Metals &amp; Alloys- Structure &amp; Phase Studies