Non-bonded ultrasonic transducer

Patent · 06 July 1984

OSTI ID:5714270

Eoff, J M

A mechanically assembled non-bonded ultrasonic transducer includes a substrate, a piezoelectric film, a wetting agent, a thin metal electrode, and a lens held in intimate contact by a mechanical clamp. No epoxy or glue is used in the assembly of this device.

• Research Organization: Rockwell International Corp., Golden, CO (USA)
• DOE Contract Number: AC04-76DP03533
• Assignee: Dept. of Energy
• Patent Number(s): None
• Application Number: ON: DE85011006
• OSTI ID: 5714270
• Country of Publication: United States
• Language: English

Related Subjects

42 ENGINEERING
420500* -- Engineering-- Materials Testing
ACOUSTIC TESTING
DESIGN
ELECTRICITY
MATERIALS TESTING
NONDESTRUCTIVE TESTING
PIEZOELECTRICITY
TESTING
TRANSDUCERS
ULTRASONIC TESTING