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The intergranular segregation of boron in substoichiometric Ni/sub 3/Al

Technical Report ·
DOI:https://doi.org/10.2172/5683643· OSTI ID:5683643
The intermetallic compound Ni/sub 3/Al offers promise as a material for high temperature applications. In addition to its unusual property of increasing strength with temperature (until approx.700/sup 0/C), it has excellent corrosion and oxidation resistance. Microalloying the alloy with boron has been shown to be dramatically effective in improving its inherent intergranular brittleness. This improvement results from the strong tendency of boron to segregate to the grain boundaries of Ni/sub 3/Al. This research deals with the study of the segregation behavior of boron. Auger electron spectroscopy was chosen as the technique adopted to study this segregation. The strong effect of segregant level on the grain boundary strength level can be controlled by thermal history variations and by variations in the level of solute in the bulk. Cathodic hydrogen charging was shown to be a potent tool in opening up other wise cohesive boundaries for analysis. The effective binding energy of boron at the grain boundaries of Ni/sub 3/Al was calculated from experimental data; it was found to vary between 0.2 and 0.45 eV. Kinetics of segregation have been investigated; the present set of kinetic studies were shown to be inadequate to find a diffusion coefficient and that temperatures lower than those studied here need to be used. As an associated investigation, a set of elemental standards were developed for the particular scanning Auger microprobe used in this study. 141 refs., 94 figs., 26 tabs.
Research Organization:
Oak Ridge National Lab., TN (USA)
DOE Contract Number:
AC05-84OR21400
OSTI ID:
5683643
Report Number(s):
ORNL/TM-10508; ON: DE88004783
Country of Publication:
United States
Language:
English