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Title: Integral glass encapsulation for solar arrays. Interim report No. 2

Technical Report ·
DOI:https://doi.org/10.2172/5666522· OSTI ID:5666522

This report covers Phase II of a program to develop integral glass encapsulation for solar arrays. The program objective has been to continue the development of electrostatic bonding (ESB) as an encapsulation technique for terrestrial cells. Electrostatic bonding is a process with general applicability to joining metals, semiconductors, and insulators to glass without the aid of adhesives. Elevated temperature is employed to produce ionic conductivity within the glass, while an externally applied electric field is used to move mobile ions near the interface being joined, so that permanent chemical bonding can occur. When applied to solar cell encapsulation this technique works well for either bare silicon cells or those with a variety of antireflective coatings. The advantages of glass as an encapsulant are numerous; optical clarity, moisture impermeability, chemical and environmental stability, and mechanical strength are just a few. Electrostatic bonding takes full advantage of all the favorable properties of glass. No adhesives, pottants, secondary encapsulants, sealers, or primers are needed to join the cells to the glass. Furthermore, the bond between the cell and glass is stronger than either material. Thus loss of optical coupling or optical transmission is precluded by the use of electrostatic bonding. The project status is reported in detail. (WHK)

Research Organization:
Spire Corp., Bedford, MA (USA)
Sponsoring Organization:
USDOE; JET PROPULSION LABORATORY
DOE Contract Number:
NAS-7-100-954521
OSTI ID:
5666522
Report Number(s):
DOE/JPL/954521-1
Country of Publication:
United States
Language:
English