A correlation of air-coupled ultrasonic and thermal diffusivity data for CFCC materials

Conference · Wed Jan 01 00:00:00 EST 1997

OSTI ID:565558

Pillai, T A.K. ^[1]; Easler, T E; Szweda, A ^[2]

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1. Univ. of Wisconsin, LaCrosse, WI (United States). Dept. of Physics
2. Dow Corning Corp., Midland, MI (United States). Advanced Ceramics Program; and others

An air-coupled (non contact) through-transmission ultrasonic investigation has been conducted on 2D multiple ply Nicalon{trademark} SiC fiber/SiNC CFCC panels as a function of number of processing cycles. Corresponding thermal diffusivity imaging was also conducted. The results of the air-coupled ultrasonic investigation correlated with thermal property variations determined via infrared methods. Areas of delaminations were detected and effects of processing cycles were also detected.

• Research Organization: Argonne National Lab. (ANL), Argonne, IL (United States)
• Sponsoring Organization: USDOE Assistant Secretary for Energy Efficiency and Renewable Energy, Washington, DC (United States)
• DOE Contract Number: W-31-109-ENG-38
• OSTI ID: 565558
• Report Number(s): ANL/ET/CP-94666; CONF-970111-; ON: DE98050022; TRN: 98:000808
• Resource Relation: Conference: 21. annual conference and expo on composites, advanced cermics, materials and structures, Cocoa Beach, FL (United States), 12-16 Jan 1997; Other Information: PBD: Jan 1997
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
COMPOSITE MATERIALS
SILICON CARBIDES
SILICON NITRIDES
THERMAL DIFFUSIVITY
PROCESSING
ULTRASONIC WAVES