Microstructure development and interface studies in thick film conductor systems
A new thick film conductor system which used acid treated (.01N HCl) lead borosilicate glass particles with chemically coated metal (silver) film was developed. Using only 40 wt% metal (silver), sheet resistivities as low as 45 milliohms/sq were obtained in this system. Detailed study of the microstructure development was done. Effect of the acid treatment of the glass particles prior to the metal coating was analyzed. X-ray photoelectron spectra studies showed preferential leaching of lead and boron from the surface of the glass. Good bonding between silver film and the glass was attributed to the oxidation of silver (to form Ag/sup +/) in the presence of oxygen and H/sup +/ ions on the glass surface (from acid treatment) and subsequent diffusion of Ag/sup +/ into the glass to form a continuous chemical interface. A model to predict sheet resistivities of the new thick film conductors was developed.
- Research Organization:
- California Univ., Berkeley (USA). Lawrence Berkeley Lab.
- DOE Contract Number:
- W-7405-ENG-48
- OSTI ID:
- 5648938
- Report Number(s):
- LBL-9274
- Resource Relation:
- Other Information: Thesis
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
BORON SILICATES
INTERFACES
MICROSTRUCTURE
ELECTRIC CONDUCTORS
FABRICATION
GLASS
LEAD SILICATES
SILVER
BONDING
CHEMICAL COATING
ELECTRIC CONDUCTIVITY
FIBERS
LEACHING
OXIDATION
SURFACE COATING
BORON COMPOUNDS
CHEMICAL REACTIONS
CRYSTAL STRUCTURE
DEPOSITION
DISSOLUTION
ELECTRICAL PROPERTIES
ELEMENTS
JOINING
LEAD COMPOUNDS
METALS
OXYGEN COMPOUNDS
PHYSICAL PROPERTIES
SEPARATION PROCESSES
SILICATES
SILICON COMPOUNDS
TRANSITION ELEMENTS
360202* - Ceramics
Cermets
& Refractories- Structure & Phase Studies
360201 - Ceramics
Cermets
& Refractories- Preparation & Fabrication