On the formation of interfacial and internal voids in {alpha}-Al{sub 2}O{sub 3} scales
- Oak Ridge National Lab., TN (United States)
Microstructural observations were used as the basis for a discussion of the formation and growth of voids in alumina scales. Reactive-element additions to alloys and alloy desulfurization appear to inhibit the growth of interfacial voids, thus improving scale adhesion. This phenomenon is analyzed in terms of surface energies. In addition, a model is proposed for the formation of large internal voids in {alpha}-Al{sub 2}O{sub 3} scales. These voids appear to be too large to form as a result of vacancy coalescence and are more frequently observed in scales not doped with a reactive element. The model is based on a growth mechanism where inward and outward growing ridges at scale grain boundaries eventually seal off and form internal voids.
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- AC05-96OR22464
- OSTI ID:
- 563591
- Journal Information:
- Oxidation of Metals, Journal Name: Oxidation of Metals Journal Issue: 3-4 Vol. 48; ISSN 0030-770X; ISSN OXMEAF
- Country of Publication:
- United States
- Language:
- English
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