Elevated temperature mechanical behavior of monolithic and SiC whisker-reinforced silicon nitrides

Technical Report · Sun Dec 01 04:00:00 EST 1991

OSTI ID:5620861

Salem, J A; Choi, S R; Sanders, W A; Fox, D S

The mechanical behavior of a 30 volume percent SiC whisker reinforced silicon nitride and a similar monolithic silicon nitride were measured at several temperatures. Measurements included strength, fracture toughness, crack growth resistance, dynamic fatigue susceptibility, post oxidation strength, and creep rate. Strength controlling defects were determined with fractographic analysis. The addition of SiC whiskers to silicon nitride did not substantially improve the strength, fracture toughness, or crack growth resistance. However, the fatigue resistance, post oxidation strength, and creep resistance were diminished by the whisker addition.

• Research Organization: National Aeronautics and Space Administration, Cleveland, OH (United States). Lewis Research Center
• OSTI ID: 5620861
• Report Number(s): N-92-15192; NASA-TM--105245; E--6572; NAS--1.15:105245
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
360203* -- Ceramics
Cermets
& Refractories-- Mechanical Properties
CARBIDES
CARBON COMPOUNDS
CHEMICAL REACTIONS
CRACK PROPAGATION
CREEP
CRYSTALS
DEFECTS
FATIGUE
FRACTURE PROPERTIES
MATERIALS
MECHANICAL PROPERTIES
MONOCRYSTALS
NITRIDES
NITROGEN COMPOUNDS
OXIDATION
PNICTIDES
REINFORCED MATERIALS
SILICON CARBIDES
SILICON COMPOUNDS
SILICON NITRIDES
TEMPERATURE EFFECTS
WHISKERS