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U.S. Department of Energy
Office of Scientific and Technical Information

Soft x-ray lithography at Berkeley's Advanced Light Source

Conference ·
OSTI ID:5529271
 [1];  [2];  [3]
  1. Intel Corp., Santa Clara, CA (USA)
  2. California Univ., Berkeley, CA (USA)
  3. Lawrence Berkeley Lab., CA (USA) California Univ., Berkeley, CA (USA)

This report discusses: the DARPA x-ray lithography program, uniqueness of the advanced light source; the advanced light source: on schedule for 1993; an ALS undulator beamline, an ALS bending magnet beamline; x-ray multilayer mirror technology, x-ray lithography at IBM; projection lithography using soft x-rays; resist characterization and profile simulation; and industrial perspective on x-ray lithography.

Research Organization:
Lawrence Berkeley Lab., CA (USA)
Sponsoring Organization:
DOE; USDOE, Washington, DC (USA)
DOE Contract Number:
AC03-76SF00098
OSTI ID:
5529271
Report Number(s):
LBL-30431; CONF-910185--; ON: DE91013756
Country of Publication:
United States
Language:
English