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Title: Packaging-induced failure of semiconductor lasers and optical telecommunications components

Conference ·
OSTI ID:552091
 [1]
  1. Corning Inc., NY (United States)

Telecommunications equipment for field deployment generally have specified lifetimes of > 100,000 hr. To achieve this high reliability, it is common practice to package sensitive components in hermetic, inert gas environments. The intent is to protect components from particulate and organic contamination, oxidation, and moisture. However, for high power density 980 nm diode lasers used in optical amplifiers, the authors found that hermetic, inert gas packaging induced a failure mode not observed in similar, unpackaged lasers. They refer to this failure mode as packaging-induced failure, or PIF. PIF is caused by nanomole amounts of organic contamination which interact with high intensity 980 nm light to form solid deposits over the emitting regions of the lasers. These deposits absorb 980 nm light, causing heating of the laser, narrowing of the band gap, and eventual thermal runaway. The authors have found PIF is averted by packaging with free O{sub 2} and/or a getter material that sequesters organics.

Research Organization:
International Society for Optical Engineering, Washington, DC (United States)
OSTI ID:
552091
Report Number(s):
CONF-9510106-Vol.2714; TRN: 97:005737-0069
Resource Relation:
Conference: 27. annual symposium on optical materials for high power lasers, Boulder, CO (United States), 30 Oct - 1 Nov 1995; Other Information: PBD: [1996]; Related Information: Is Part Of Laser-induced damage in optical materials: 1995. Twenty-seventh annual Boulder damage symposium, proceedings; Bennett, H.E.; Guenther, A.H.; Kozlowski, M.R.; Newnam, B.E.; Soileau, M.J. [eds.]; PB: 794 p.
Country of Publication:
United States
Language:
English