Layer growth in Au-Pb/In solder joints
The solid state reaction between a Pb-In solder alloy and thin film Au has been investigated at ten aging temperatures ranging from 70 to 170/sup 0/C. Also, bulk Au-solder samples were aged at 150/sup 0/C for metallographic analysis. No significant difference was found between the aging behavior of thin and bulk Au specimens. A thin single phase layer of Au/sub 9/In/sub 4/ was found adjacent to Au while a thick two-phase layer of AuIn/sub 2/ and Pb was found between Au/sub 9/In/sub 4/ and solder. The Pb phase was shown to have considerable mobility and able to ripen at room temperature. Peculiar planar interface instabilities and voids in the Au-Au/sub 9/In/sub 4/ interface were found. The total layer thickness was found to vary linearly with aging time, indicating an interface-controlled reaction. An activation energy of 14,000 calories per mole was found by regression analysis of the kinetic data.
- Research Organization:
- Sandia National Labs., Albuquerque, NM (USA)
- DOE Contract Number:
- AC04-76DP00789
- OSTI ID:
- 5501244
- Report Number(s):
- SLA-73-5963; ON: DE86013552
- Resource Relation:
- Other Information: Paper copy only, copy does not permit microfiche production
- Country of Publication:
- United States
- Language:
- English
Similar Records
Growth of a Au-Ni-Sn intermetallic compound on the solder-substrate interface after aging
An analysis of the pull strength behaviors of fine-pitch, flip chip solder interconnections using a Au-Pt-Pd thick film conductor on Low-Temperature, Co-fired Ceramic (LTCC) substrates.
Related Subjects
GOLD
SOLDERING
INDIUM ALLOYS
LEAD ALLOYS
SOLDERED JOINTS
PHASE STUDIES
AGING
CHEMICAL REACTIONS
HIGH TEMPERATURE
INTERFACES
INTERMETALLIC COMPOUNDS
LAYERS
MEDIUM TEMPERATURE
MICROSTRUCTURE
TEMPERATURE DEPENDENCE
THICKNESS
VOIDS
ALLOYS
CRYSTAL STRUCTURE
DIMENSIONS
ELEMENTS
FABRICATION
JOINING
JOINTS
METALS
TRANSITION ELEMENTS
WELDING
360101* - Metals & Alloys- Preparation & Fabrication