Isothermal fatigue behavior of Sn--Pb solder joints
Isothermal fatigue data were collected for the compositions 5Sn--95Pb, 20Sn--80Pb, 40Sn--60Pb, 50Sn--50Pb and 63Sn--37Pb within the binary Sn--Pb system. All of these compositions are commercially available and include those most commonly used. Because Sn-rich solders are rarely used, they were not investigated here. The fatigue life was defined by a 30% load drop. The solders were tested in a double shear configuration joined to copper at 75{degree}C. The displacement rate chosen was 0.01 mm/min, which corresponds to a strain rate of 1.5 {times} 10{sup {minus}4} s{sup {minus}1} for our specimen configuration, over a 10% plastic strain range. Additionally, the microstructural changes during fatigue are presented. The various solder compositions studied exhibit strikingly different as-solidified microstructures. These differences are discussed in terms of their effect on the isothermal joint failure mechanism and joint isothermal fatigue life. 24 refs., 10 figs.
- Research Organization:
- Lawrence Berkeley Lab., CA (USA)
- Sponsoring Organization:
- DOE/ER
- DOE Contract Number:
- AC03-76SF00098
- OSTI ID:
- 5487649
- Report Number(s):
- LBL-27774; CONF-891208--25; ON: DE90003280
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
360102 -- Metals & Alloys-- Structure & Phase Studies
360103* -- Metals & Alloys-- Mechanical Properties
ALLOY SYSTEMS
ALLOYS
BINARY ALLOY SYSTEMS
CRYSTAL STRUCTURE
DEFORMATION
FAILURES
FATIGUE
JOINTS
LEAD ALLOYS
MECHANICAL PROPERTIES
MICROSTRUCTURE
SHEAR
SOLDERED JOINTS
STRAIN RATE
TIN ALLOYS