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Stability of protective oxide films on Ti-base alloys

Journal Article · · Oxidation of Metals; (United States)
DOI:https://doi.org/10.1007/BF01151593· OSTI ID:5465295
 [1]
  1. G.E. Corporate Research and Development, Schenectady, NY (United States)
Thermodynamic calculations are performed to estimate isothermal sections of Ti-Al-O, Ti-Si-O, and Ni-Al-O phase diagrams. Very small aluminum levels (<10{sup {minus}10} at.%) are needed to stabilize alumina on Ni-Al alloys. However, much higher aluminum ({approx gt}50%) and silicon ({approx gt}40%) levels are needed to stabilize alumina and silica on Ti-Al and Ti-Si alloys, respectively. These calculations suggest that the mechanism of formation of the protective oxide films of titanium-based alloys is radically different from that on nickel-based alloys. The aluminum levels needed to form a continuous film of alumina on nickel-based alloys are dominated by kinetic factors. On the other hand, thermodynamic factors appear to dominate the alloy compositions needed to form protective films of alumina and silica on titanium-based alloys. Further work is needed to evaluate any possible role of kinetic factors.
OSTI ID:
5465295
Journal Information:
Oxidation of Metals; (United States), Journal Name: Oxidation of Metals; (United States) Vol. 36:5-6; ISSN 0030-770X; ISSN OXMEA
Country of Publication:
United States
Language:
English