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Title: Microelectronic superconducting device with multi-layer contact

Patent ·
OSTI ID:5403807

A microelectronic component comprising a crossover is provided comprising a substrate, a first high T[sub c] superconductor thin film, a second insulating thin film comprising SrTiO[sub 3] ; and a third high T[sub c] superconducting film which has strips which crossover one or more areas of the first superconductor film. An in situ method for depositing all three films on a substrate is provided which does not require annealing steps. The photolithographic process is used to separately pattern the high T[sub c] superconductor thin films. 14 figures.

DOE Contract Number:
AC03-76SF00098
Assignee:
Univ. of Calif., Oakland, CA (United States)
Patent Number(s):
US 5256636; A
Application Number:
PPN: US 7-586435
OSTI ID:
5403807
Resource Relation:
Patent File Date: 21 Sep 1990
Country of Publication:
United States
Language:
English