Mechanical properties and microstructure of a novel SiC/SiC joint
Conference
·
OSTI ID:539144
- Ames Lab., IA (United States); and others
A low temperature bonding agent containing the mixture of a preceramic oligomeric polymer, the Si-Al powder and the boron powder, was applied to the SiC/SiC composites. The curing was made by heat-treatments at 1000{degrees}C, 1200{degrees}C and 1400{degrees}C for 5 hours in air. Mechanical properties of the joints were evaluated by flexure tests at room temperature. Average joint strength at all three curing temperature was 95 MPa while the shear strength was about 50 MPa. Joint regions were porous and contained several phases including SiC, Al{sub 2}O{sub 3}, Al, Si, C, AlB{sub 10} and residual polymer.
- DOE Contract Number:
- W-7405-ENG-82
- OSTI ID:
- 539144
- Report Number(s):
- CONF-9604124--
- Country of Publication:
- United States
- Language:
- English
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