Electrochemical deposition of copper onto Pt(111) in the presence of (bi)sulfate anions

Journal Article · Fri Aug 01 04:00:00 EDT 1997 · Physical Review, B: Condensed Matter

DOI:https://doi.org/10.1103/PhysRevB.56.3651· OSTI ID:538530

Lucas, C A ^[1]; Markovic, N M; Ross, P N ^[1]

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1. Materials Sciences Division, Lawrence Berkeley National Laboratory, University of California, Berkeley, California 94720 (United States)

Using {ital in situ} x-ray diffraction we have studied the underpotential deposition (UPD) of copper onto a Pt(111) electrode in sulfuric acid. Deposition occurs in a two-stage process; close to a full monolayer of Cu being preceded by a ({radical}(3){times}{radical}(3))R30{degree} structure that consists of both Cu and (bi)sulfate anions and is similar to the structure observed on the Au(111) electrode. Utilizing anomalous scattering methods we can accurately determine the Cu coverage during UPD and propose structural models based on crystal truncation rod measurements. {copyright} {ital 1997} {ital The American Physical Society}

• Research Organization: Lawrence Berkeley National Laboratory
• DOE Contract Number: AC03-76SF00098
• OSTI ID: 538530
• Journal Information: Physical Review, B: Condensed Matter, Journal Name: Physical Review, B: Condensed Matter Journal Issue: 7 Vol. 56; ISSN 0163-1829; ISSN PRBMDO
• Country of Publication: United States
• Language: English

Related Subjects

66 PHYSICS
COPPER
CRYSTAL STRUCTURE
ELECTROCHEMICAL COATING
ELECTROCHEMISTRY
ELECTRODES
ELECTROLYTES
INTERFACES
PLATINUM
SULFURIC ACID
X-RAY DIFFRACTION