Method for palladium activating molybdenum metallized features on a ceramic substrate
Patent
·
OSTI ID:5385281
A molybdenum or tungsten metallurgical pattern is formed on or in a dielectric green sheet. Palladium, nickel, platinum or rhodium is coated on a layer of polyvinyl butyral which is carried on a polyester film. The metal layer of this assembly is laminated to a dielectric green sheet which carries the molybdenum or tungsten metallurgy. The polyester film is stripped off. The resulting assembly is sintered to a fired structure, whereby the polyvinyl butyral is volatilized off and the palladium, nickel, platinum or rhodium is alloyed with the molybdenum or tungsten metallurgy to provide a densified metallurgy whose surface is free of glass.
- Assignee:
- International Business Machines Corporation
- Patent Number(s):
- US 4510000
- OSTI ID:
- 5385281
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
36 MATERIALS SCIENCE
360201* -- Ceramics
Cermets
& Refractories-- Preparation & Fabrication
CERAMICS
DEPOSITION
DIELECTRIC MATERIALS
ELECTRIC CONDUCTORS
ELEMENTS
ESTERS
FABRICATION
FILMS
JOINING
LAYERS
MATERIALS
METALLURGY
METALS
MOLYBDENUM
NICKEL
ORGANIC COMPOUNDS
ORGANIC POLYMERS
PALLADIUM
PLATINUM
PLATINUM METALS
POLYESTERS
POLYMERS
POLYVINYLS
RHODIUM
SINTERING
SOLDERING
SUBSTRATES
THIN FILMS
TRANSITION ELEMENTS
TUNGSTEN
WELDING
360201* -- Ceramics
Cermets
& Refractories-- Preparation & Fabrication
CERAMICS
DEPOSITION
DIELECTRIC MATERIALS
ELECTRIC CONDUCTORS
ELEMENTS
ESTERS
FABRICATION
FILMS
JOINING
LAYERS
MATERIALS
METALLURGY
METALS
MOLYBDENUM
NICKEL
ORGANIC COMPOUNDS
ORGANIC POLYMERS
PALLADIUM
PLATINUM
PLATINUM METALS
POLYESTERS
POLYMERS
POLYVINYLS
RHODIUM
SINTERING
SOLDERING
SUBSTRATES
THIN FILMS
TRANSITION ELEMENTS
TUNGSTEN
WELDING