Mold method for superconductive joint fabrication
Patent
·
OSTI ID:5369345
A method is described for forming superconductive joints in multifilamentary superconductor wire embedded in a metal matrix comprising the steps of: disposing the ends of the multifilamentary superconductor wires to be joined in a hot liquid metal stripping bath for removal of the metal matrix; removing the wire ends from the stripping bath; disposing the wire ends in a hot liquid superconductive solder; removing the wire ends from the hot liquid superconductive solder; inserting the wire ends in a mold and filling the mold with hot liquid superconductive solder; and solidifying the solder.
- Assignee:
- General Electric Co., Schenectady, NY
- Patent Number(s):
- US 4713878
- OSTI ID:
- 5369345
- Country of Publication:
- United States
- Language:
- English
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