Chemical anchoring of organic conducting polymers to semiconducting surfaces
According to the present invention, an improved method of coating electrodes with conductive polymer films and/or preselected catalysts is provided. The charge conductive polymer is covalently or coordinatively attached to the electrode surface to strengthen the adhesion characteristics of the polymer to the electrode surface or to improve charge conductive properties between the conductive polymer and the electrode surface. Covalent or coordinative attachment is achieved by a number of alternative methods including covalently or coordinatively attaching the desired monomer to the electrode by means of a suitable coupling reagent and, thereafter, electrochemically polymerizing the monomer in situ.
- DOE Contract Number:
- AC02-77CH00178
- Assignee:
- EDB-84-042479
- Patent Number(s):
- None
- Application Number:
- ON: DE84006158
- OSTI ID:
- 5354837
- Country of Publication:
- United States
- Language:
- English
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