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Title: Chemical anchoring of organic conducting polymers to semiconducting surfaces

Patent ·
OSTI ID:5354837

According to the present invention, an improved method of coating electrodes with conductive polymer films and/or preselected catalysts is provided. The charge conductive polymer is covalently or coordinatively attached to the electrode surface to strengthen the adhesion characteristics of the polymer to the electrode surface or to improve charge conductive properties between the conductive polymer and the electrode surface. Covalent or coordinative attachment is achieved by a number of alternative methods including covalently or coordinatively attaching the desired monomer to the electrode by means of a suitable coupling reagent and, thereafter, electrochemically polymerizing the monomer in situ.

DOE Contract Number:
AC02-77CH00178
Assignee:
EDB-84-042479
Application Number:
ON: DE84006158
OSTI ID:
5354837
Country of Publication:
United States
Language:
English