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Chemical compatibility issues related to use of copper as an interfacial layer for SiC fiber reinforced Ti3Ai+Nb composite. Final Report

Technical Report ·
OSTI ID:5341043

The reaction of Cu, a potential interfacial compliant layer for the Ti3Al plus Nb/SiC composite, with SiC, SCS-6 fiber, and the Ti3Al plus Nb matrix was examined at two temperatures: 1223 and 1273 K. Reaction of Cu with SiC resulted in the formation of a CuSi solution and free carbon, the reaction product being molten at 1273 K. Hot pressing the SCS-6 fiber in a Cu matrix at 1273 K resulted in cracking and delamination of the outer carbon-rich coating, thus allowing the Cu to penetrate to the SiC-carbon coating interface and react with SiC. In contrast, no such damage to the outer coating was observed at 1223 K. There was excessive reaction between Cu and the Ti3Al plus Nb matrix, the reaction product being molten both at 1223 and 1273 K. An interlayer of Nb between Cu and Ti3Al plus Nb matrix prevented the reaction between the two.

Research Organization:
Sverdrup Technology, Inc., Brook Park, OH (United States)
OSTI ID:
5341043
Report Number(s):
N-91-25194; NASA-CR--187100; E--6143; NAS--1.26:187100; CNN: NAS3-25266
Country of Publication:
United States
Language:
English