Effects of voids at three-grain junctions on sintering and creep damage

Journal Article · Thu Nov 01 04:00:00 EST 1984 · J. Am. Ceram. Soc.; (United States)

DOI:https://doi.org/10.1111/j.1151-2916.1984.tb19509.x· OSTI ID:5329458

Drory, M D; Evans, A G

An analysis of the growth and shrinkage rates of ellipsoidal voids on three-grain junctions is presented. The predicted rates are compared with those for cylindrical pores on the same interfaces. It is demonstrated that the sintering of ellipsoidal pores occurs more rapidly, by virtue of the increased surface curvature. The formation of such pores by the Rayleigh instability mechanism thus appears to constitute an important step in final stage sintering. Conversely, under creep loading, cylindrical voids grow at a faster rate, suggesting that creep damage develops more slowly when discrete ellipsoidal voids are maintained on three-grain junctions.

• Research Organization: Lawrence Berkeley Lab., CA
• DOE Contract Number: AC03-76SF00098
• OSTI ID: 5329458
• Journal Information: J. Am. Ceram. Soc.; (United States), Journal Name: J. Am. Ceram. Soc.; (United States) Vol. 67:11; ISSN JACTA
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
360203* -- Ceramics
Cermets
& Refractories-- Mechanical Properties
CERAMICS
CREEP
CRYSTAL STRUCTURE
DEFECTS
FABRICATION
MECHANICAL PROPERTIES
MICROSTRUCTURE
POROSITY
SINTERING
VOIDS