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Modeling and characterization of high-efficiency silicon solar cells fabricated by rapid thermal processing, screen printing, and plasma-enhanced chemical vapor deposition

Journal Article · · IEEE Transactions on Electron Devices
DOI:https://doi.org/10.1109/16.622596· OSTI ID:531512
; ; ;  [1]
  1. Georgia Inst. of Tech., Atlanta, GA (United States)

This paper presents, for the first time, the successful integration of three rapid, low-cost, high-throughput technologies for silicon solar cell fabrication, namely: rapid thermal processing (RTP) for simultaneous diffusion of a phosphorus emitter and aluminum back surface field; screen printing (SP) for the front grid contact; and low-temperature plasma-enhanced chemical vapor deposition (PECVD) of SiN for antireflection coating and surface passivation. This combination has resulted in 4 cm{sup 2} cells with efficiencies of 16.3% and 15.9% on 2 {Omega}-cm FZ and Cz, respectively, as well as 15.4% efficient, 25-cm FZ cells. Despite the respectable RTP/SP/PECVD efficiencies, cells formed by conventional furnace processing and photolithography (CFP/PL) give {approximately}2% (absolute) greater efficiencies. Through in-depth modeling and characterization, this efficiency difference is quantified on the basis of emitter design and front surface passivation, grid shading, and quality of contacts. Detailed analysis reveals that the difference is primarily due to the requirements of screen printing and not RTP.

Sponsoring Organization:
Sandia National Labs., Albuquerque, NM (United States); National Inst. of Standards and Technology, Gaithersburg, MD (United States)
OSTI ID:
531512
Journal Information:
IEEE Transactions on Electron Devices, Journal Name: IEEE Transactions on Electron Devices Journal Issue: 9 Vol. 44; ISSN 0018-9383; ISSN IETDAI
Country of Publication:
United States
Language:
English

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