Control of microstructure and properties of copper films using ion-assisted deposition

Journal Article · Sun May 01 04:00:00 EDT 1988 · J. Vac. Sci. Technol., A; (United States)

DOI:https://doi.org/10.1116/1.575339· OSTI ID:5312498

Roy, R A; Cuomo, J J; Yee, D S

The effect of argon ion bombardment on the structure and properties of thick copper films was studied. Primary deposition variables were ion flux, ion energy, substrate temperature, and substrate type. The effects of ion bombardment are profoundly different at high energy (600 eV) as opposed to low energy (62 eV). Trends in crystallographic texture, microhardness, crystallite size, and resistivity are significantly different at different ion energies on all substrates examined. At high energy, the substrate dependence of properties is small while a large dependence is seen at lower energy. This work demonstrates the independence of ion energy and ion flux as control parameters in property modification using ion-assisted deposition processes.

• Research Organization: IBM T. J. Watson Research Center, Yorktown Heights, New York 10598
• OSTI ID: 5312498
• Journal Information: J. Vac. Sci. Technol., A; (United States), Journal Name: J. Vac. Sci. Technol., A; (United States) Vol. 6:3; ISSN JVTAD
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
360101 -- Metals & Alloys-- Preparation & Fabrication
360102 -- Metals & Alloys-- Structure & Phase Studies
360106* -- Metals & Alloys-- Radiation Effects
COLLISIONS
COPPER
CRYSTAL STRUCTURE
DEPOSITION
ELECTRIC CONDUCTIVITY
ELECTRICAL PROPERTIES
ELEMENTS
ENERGY RANGE
EV RANGE
EV RANGE 100-1000
FILMS
HARDNESS
ION COLLISIONS
MECHANICAL PROPERTIES
METALS
MICROHARDNESS
MICROSTRUCTURE
MORPHOLOGY
PHYSICAL PROPERTIES
PHYSICAL RADIATION EFFECTS
RADIATION EFFECTS
STRESSES
TEXTURE
TRANSITION ELEMENTS