Determination of gold--copper alloy composition by x-ray fluorescence analysis. Final report. [In-process analysis of electroplate]

Technical Report · Thu Sep 01 04:00:00 EDT 1977

DOI:https://doi.org/10.2172/5312240· OSTI ID:5312240

Starks, D M

A method for in-process determination of the composition of electroplated gold-copper alloys using x-ray fluorescence analysis has been developed. A source-excited, non-dispersive x-ray fluorescence analyzer was procured and developed for this purpose. A set of calibration standards was procured, and a calibration curve was constructed by plotting a ratio of x-ray fluorescence intensities against known alloy composition. This technique is now being used as the primary method for in-process alloy measurements during gold-copper electroplating. It replaces a previously used technique involving the calculation of the mass density of the plated deposit. The x-ray technique has been shown to measure alloy composition to an overall precision of +-0.12 wt% using two-minute counting times. Post-plate D-tests of parts from full length plating runs show the x-ray technique to agree with electron microprobe analysis within the limits of precision.

• Research Organization: Bendix Corp., Kansas City, Mo. (USA)
• DOE Contract Number: EY-76-C-04-0613
• OSTI ID: 5312240
• Report Number(s): BDX-613-1716(Rev.)
• Country of Publication: United States
• Language: English

Related Subjects

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CHEMISTRY
400102* -- Chemical & Spectral Procedures
ALLOYS
CALIBRATION
CHEMICAL ANALYSIS
COPPER ALLOYS
DEPOSITION
ELECTRODEPOSITION
ELECTROLYSIS
ELECTROPLATING
GOLD ALLOYS
LYSIS
NONDESTRUCTIVE ANALYSIS
ON-LINE MEASUREMENT SYSTEMS
ON-LINE SYSTEMS
PLATING
SURFACE COATING
X-RAY EMISSION ANALYSIS
X-RAY FLUORESCENCE ANALYSIS