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Title: The thermohysical properties of gypsum boards containing wax

Conference ·
OSTI ID:5256634

An Unguarded Thin-Heater Apparatus (UTHA) was used to measure the thermal conductivity (k) and thermal diffusivity ({alpha}) of gypsum boards containing 0, 15, 30 wt % wax (C{sub 18}H{sub 38}) in the temperature range 20 to 50{degree}C (68 to 122{degree}F). Since this wax melts near 28{degree}C (82{degree}F), this combination provides a phase-change material for possible use in building applications. The k-values for gypsum board without wax reported here are independent of temperature and extend the available data to a lower density ({rho}). The k-values agree with data by Malloy but are 17% greater than the ASHRAE Handbook value. The k-values for the gypsum-wax composites are greater than the k-value of gypsum board without wax, increase with wax content, and correlate with a two-phase conduction model by Eucken. The k-value of composites with solid wax is greater than the k of composites with liquid wax. A step-change in heat flux transient technique was used on specimens that were initially isothermal or that had a steady imposed temperature gradient. Analysis of the temperature response of the thin-heater for short-times predicts a temperature rise that is a linear function of the square-root of time. This prediction was verified, and the slope of this relaxation provided experimental values for the product k{center dot}{rho}{center dot}C, where C is the specific heat. Experimental values of C were calculated from experimental values of k and {rho} and compared favorably with literature values of C for gypsum and predictions of C for the composites. Transient tests that heated parts of the specimen through the phase change of wax yielded very large C values. These tests required very long time to reach steady-state. 17 refs., 5 figs., 5 tabs.

Research Organization:
Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
Sponsoring Organization:
DOE/CE
DOE Contract Number:
AC05-84OR21400
OSTI ID:
5256634
Report Number(s):
CONF-8910319-2; ON: DE90004933
Resource Relation:
Conference: 21. international thermal conductivity conference, Lexington, KY (USA), 15-18 Oct 1989
Country of Publication:
United States
Language:
English