Well placement for steamflooding steeply dipping reservoirs
Patent
·
OSTI ID:5153091
This patent describes a method of steamflooding in a multi-spot pattern in a dipping reservoir. It comprises injecting steam at a steam injection point downdip from the pattern center and offset from the pattern center by at least one-fifth the distance from the pattern center to the downdip producer row of that pattern. This paper also describes a method of reducing steam channeling after steam breakthrough occurs at a producer during steamflooding in a multispot pattern in a dipping reservoir. It comprises injecting heat by steam injection at a point downdip from the pattern center and offset from the pattern center by at least one-fifth distance from the pattern center to the downdip producer row of that pattern; and reducing the rate of heat injection after the steam breakthrough.
- Assignee:
- Chevron Research and Technology Co., San Francisco, CA (United States)
- Patent Number(s):
- US 5101898; A
- Application Number:
- PPN: US 7-672256
- OSTI ID:
- 5153091
- Country of Publication:
- United States
- Language:
- English
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