Adhesion of PVD intermediate layers in solid state bonding applications. Final report

Technical Report · Sun Dec 01 04:00:00 EST 1985

OSTI ID:5146444

Schalansky, C; Munir, Z A

The conditions prevailing during the deposition of thick metallic films by the hot-hollow cathode method were investigated. The spacial distribution of temperature, surface roughness, and depth of etch during the pre-deposition etching cycle was investigated for two different sample holder designs. The influence of substrate temperature and the angle of incidence of the vapor on the structure and adhesion of thick silver films to type 304 stainless steel was determined. The nature and strength of adhesion were evaluated on the basis of microscopic examinations and tensile test determinations. Similar evaluations were made on tensile test samples formed through electroplating copper and nickel onto the silver films instead of the joining of two silver-coated samples hot-isostatic pressing.

• Research Organization: California Univ., Davis (USA). Div. of Materials Science and Engineering
• DOE Contract Number: W-7405-ENG-48
• OSTI ID: 5146444
• Report Number(s): UCRL-15841; ON: DE87001305
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
360100* -- Metals & Alloys
ADHESION
ALLOYS
BONDING
CHROMIUM ALLOYS
CHROMIUM STEELS
CHROMIUM-NICKEL STEELS
COPPER
CORROSION RESISTANT ALLOYS
DEPOSITION
ELECTRODEPOSITION
ELECTROLYSIS
ELECTROPLATING
ELEMENTS
FABRICATION
FILMS
HEAT RESISTANT MATERIALS
HEAT RESISTING ALLOYS
HOT PRESSING
IRON ALLOYS
IRON BASE ALLOYS
JOINING
LYSIS
MATERIALS
MATERIALS WORKING
METALS
NICKEL
NICKEL ALLOYS
PLATING
PRESSING
SILVER
STAINLESS STEEL-304
STAINLESS STEELS
STEELS
SURFACE COATING
TRANSITION ELEMENTS
VAPOR PLATING