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Smooth polycrystalline ceramic substrates with enhanced metal adhesion by pulsed excimer laser processing

Journal Article · · Applied Physics Letters; (United States)
DOI:https://doi.org/10.1063/1.111810· OSTI ID:5119815
 [1]; ; ;  [2]; ;  [3]
  1. Solid State Division, Oak Ridge National Laboratory, P. O. Box 2008, Oak Ridge, Tennessee 37831-6056 (United States)
  2. Department of Materials Science and Engineering, The University of Tennessee, Knoxville, Tennessee 37996-2200 (United States)
  3. Health and Safety Research Division, Oak Ridge National Laboratory, Oak Ridge, Tennessee 37831-6024 (United States)

Multishot pulsed XeCl (308 nm) excimer laser irradiation of commercial fine-grained polycrystalline alumina substrates is found to significantly improve their properties for metal film-bonding applications. A smoother surface finish is obtained, and the adhesion strength of subsequently deposited copper films to the laser-treated alumina surface is increased by a factor of 3--5 (200%--400%) under optimum laser conditions. Smoothing occurs when the alumina melts and undergoes molten flow before resolidifying. XPS measurements suggest that electrical activation of the near-surface region also may contribute to the enhanced copper adhesion.

DOE Contract Number:
AC05-84OR21400
OSTI ID:
5119815
Journal Information:
Applied Physics Letters; (United States), Journal Name: Applied Physics Letters; (United States) Vol. 64:14; ISSN APPLAB; ISSN 0003-6951
Country of Publication:
United States
Language:
English