Smooth polycrystalline ceramic substrates with enhanced metal adhesion by pulsed excimer laser processing
                            Journal Article
                            ·
                            
                            · Applied Physics Letters; (United States)
                            
                        
                    - Solid State Division, Oak Ridge National Laboratory, P. O. Box 2008, Oak Ridge, Tennessee 37831-6056 (United States)
- Department of Materials Science and Engineering, The University of Tennessee, Knoxville, Tennessee 37996-2200 (United States)
- Health and Safety Research Division, Oak Ridge National Laboratory, Oak Ridge, Tennessee 37831-6024 (United States)
Multishot pulsed XeCl (308 nm) excimer laser irradiation of commercial fine-grained polycrystalline alumina substrates is found to significantly improve their properties for metal film-bonding applications. A smoother surface finish is obtained, and the adhesion strength of subsequently deposited copper films to the laser-treated alumina surface is increased by a factor of 3--5 (200%--400%) under optimum laser conditions. Smoothing occurs when the alumina melts and undergoes molten flow before resolidifying. XPS measurements suggest that electrical activation of the near-surface region also may contribute to the enhanced copper adhesion.
- DOE Contract Number:
- AC05-84OR21400
- OSTI ID:
- 5119815
- Journal Information:
- Applied Physics Letters; (United States), Journal Name: Applied Physics Letters; (United States) Vol. 64:14; ISSN APPLAB; ISSN 0003-6951
- Country of Publication:
- United States
- Language:
- English
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                                                36 MATERIALS SCIENCE
360606* -- Other Materials-- Physical Properties-- (1992-)
ADHESION
ALUMINIUM COMPOUNDS
ALUMINIUM OXIDES
CHALCOGENIDES
CRYSTALS
ELECTROMAGNETIC RADIATION
ELEMENTS
EMISSION
EXCIMER LASERS
FILMS
GAS LASERS
LASER RADIATION
LASERS
METALS
OXIDES
OXYGEN COMPOUNDS
PHOTOEMISSION
POLYCRYSTALS
RADIATIONS
SECONDARY EMISSION
SUBSTRATES
THIN FILMS
                                            
                                        
                                    
                                
                            
                        360606* -- Other Materials-- Physical Properties-- (1992-)
ADHESION
ALUMINIUM COMPOUNDS
ALUMINIUM OXIDES
CHALCOGENIDES
CRYSTALS
ELECTROMAGNETIC RADIATION
ELEMENTS
EMISSION
EXCIMER LASERS
FILMS
GAS LASERS
LASER RADIATION
LASERS
METALS
OXIDES
OXYGEN COMPOUNDS
PHOTOEMISSION
POLYCRYSTALS
RADIATIONS
SECONDARY EMISSION
SUBSTRATES
THIN FILMS