Electroless copper films deposited onto laser-activated aluminum nitride and alumina

Journal Article · Fri Apr 01 04:00:00 EST 1994 · Journal of Materials Research; (United States)

DOI:https://doi.org/10.1557/JMR.1994.1019· OSTI ID:5115637

DeSilva, M J; Pedraza, A J ^[1]; Lowndes, D H ^[2]

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1. Department of Materials Science and Engineering, University of Tennessee, Knoxville, Tennessee 37996-2200 (United States)
2. Department of Materials Science and Engineering, University of Tennessee, Knoxville, Tennessee 37996-2200 (United States) Solid State Division, Oak Ridge National Laboratory, Oak Ridge, Tennessee 37831-6056 (United States)

Metallization of ceramic substrates by laser activation and subsequent electroless deposition has been demonstrated recently in aluminum nitride and alumina. However, the bond strength between the electroless copper and the ceramic substrate is weak (less than 14 MPa). Low temperature annealing of electroless copper films deposited on substrates activated at low laser energies strongly increases the adhesion strength. The effectiveness of the annealing for improving the metal-ceramic bonding is dependent upon the laser treatment performed on the substrate prior to deposition. Faster deposition kinetics are obtained for both substrates by increasing the laser energy density. On the other hand, an increase in the laser energy density leads to poor adhesion strengths. The dislocation microstructure produced during laser irradiation in aluminum nitride is analyzed as a possible cause of laser activation. Free aluminum produced by laser irradiation of aluminum nitride and of alumina is discussed as another factor of laser activation. The chemical and microstructural changes taking place in the near-surface region as a consequence of laser-induced processes are correlated with adhesion enhancement promoted by the annealing treatment.

• OSTI ID: 5115637
• Journal Information: Journal of Materials Research; (United States), Journal Name: Journal of Materials Research; (United States) Vol. 9:4; ISSN JMREEE; ISSN 0884-2914
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
360101 -- Metals & Alloys-- Preparation & Fabrication
360200* -- Ceramics
Cermets
& Refractories
ADHESION
ALUMINIUM COMPOUNDS
ALUMINIUM NITRIDES
ALUMINIUM OXIDES
ANNEALING
CHALCOGENIDES
CHEMICAL ACTIVATION
COPPER
DEPOSITION
ELECTROMAGNETIC RADIATION
ELEMENTS
FILMS
HEAT TREATMENTS
LASER RADIATION
METALS
MICROSTRUCTURE
NITRIDES
NITROGEN COMPOUNDS
OXIDES
OXYGEN COMPOUNDS
PNICTIDES
RADIATIONS
SURFACE COATING
TRANSITION ELEMENTS