Impurity effects on the Ni/Ni{sub 3}Al interface cohesion

Journal Article · Thu May 01 04:00:00 EDT 1997 · Acta Materialia

DOI:https://doi.org/10.1016/S1359-6454(96)00329-1· OSTI ID:509131

Liu, Y; Chen, K Y; Lu, G; Zhang, J H; Hu, Z Q ^[1]

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1. Chinese Academy of Sciences, Shenyang (China)

The effects of B, C, N, O, H, P and S impurities on the Ni/Ni{sub 3}Al interface cohesion have been investigated by employing first-principles electronic structure calculations based on the discrete variational method. The binding energy, bond order, difference electron density, orbital occupations and density of states have been calculated to study the impurity-induced changes in the energetics and electronic structure. The impurities promote the Ni/Ni{sub 3}Al interface cohesion and prefer to occupy the interface interstitial sites in the order S < P < H < O < N < B < C. The impurity-nickel covalent-like bonds form mainly due to impurity-p/Ni-d hybridization (except H-s/Ni-p hybridization in the H case). Meanwhile, the Ni-Ni bonding becomes weaker because of charge depletion on Ni atoms and bond misorientation resulting from the more homogeneous electron redistribution. In the order B, C, N and O, the impurity-metal bond varies from being homopolar to being much more heteropolar with increasing ionicity percentage, which results in decreasing p-d hybridization effects.

• OSTI ID: 509131
• Journal Information: Acta Materialia, Journal Name: Acta Materialia Journal Issue: 5 Vol. 45; ISSN 1359-6454; ISSN ACMAFD
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
ADHESION
BINDING ENERGY
ELECTRON DENSITY
ELECTRONIC STRUCTURE
IMPURITIES
INTERFACES
INTERMETALLIC COMPOUNDS
INTERSTITIALS
MICROSTRUCTURE
NICKEL BASE ALLOYS