End-of-process detection for plasma cleaning
Activated gas plasma is being used extensively to remove trace organic contamination from electromechanical components prior to final assembly. Optical emission techniques are being used throughout the electronics industry to determine end-points of plasma processes for removing large amounts of different materials such as photo-resist and silicon and aluminum compounds. A project was undertaken for the application of these techniques to detect the removal of trace organic residues. These techniques gave a definite end-point and their application to detect the removal of trace organic residues was shown to be possible using a process monitor. Removal of organic contamination as low as 0.5 mg total was detected in an oxygen plasma. Auger analysis confirmed the cleanliness levels indicated by the end-point detector tested. The simplicity of this type of process monitor lends itself to production line use for the plasma cleaning of various parts and batch sizes. The monitoring of argon plasma cleaning processes using optical emission techniques has also been investigated. 22 figures.
- Research Organization:
- Bendix Corp., Kansas City, MO (USA)
- DOE Contract Number:
- AC04-76DP00613
- OSTI ID:
- 5087923
- Report Number(s):
- BDX-613-2648; CONF-820387-1; ON: DE82020086
- Country of Publication:
- United States
- Language:
- English
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