Method using laser irradiation for the production of atomically clean crystalline silicon and germanium surfaces
This invention relates to a new method for removing surface impurities from crystalline silicon or germanium articles, such as off-the-shelf p- or n-type wafers to be doped for use as junction devices. The principal contaminants on such wafers are oxygen and carbon. The new method comprises laser-irradiating the contaminated surface in a non-reactive atmosphere, using one or more of Q-switched laser pulses whose parameters are selected to effect melting of the surface without substantial vaporization thereof. In a typical application, a plurality of pulses is used to convert a surface region of an off-the-shelf silicon wafer to an atomically clean region. This can be accomplished in a system at a pressure below 10-/sup 8/ Torr, using Q-switched ruber-laser pulses having an energy density in the range of from about 60 to 190 MW/cm/sup 2/.
- DOE Contract Number:
- W-7405-ENG-26
- Assignee:
- TIC; ERA-05-035145; EDB-80-106852
- OSTI ID:
- 5068798
- Country of Publication:
- United States
- Language:
- English
Similar Records
Method using laser irradiation for the production of atomically clean crystalline silicon and germanium surfaces
Germanium ion implantation to Improve Crystallinity during Solid Phase Epitaxy and the effect of AMU Contamination