Skip to main content
U.S. Department of Energy
Office of Scientific and Technical Information

A new doping technique for high throughput solar cell fabrication

Conference · · Conf. Rec. IEEE Photovoltaic Spec. Conf.; (United States)
OSTI ID:5050689
Various doping techniques such as gas diffusion, paint-on methods, ion implantation, and screen printing are customarily used in silicon solar cell fabrication. This paper presents a new technique, called plasma doping, as a low cost approach suitable for high throughput production. The method is based on a high-frequency low-pressure plasma of a dopant gas. Accelerating the dopant ions onto the silicon wafers by means of an additional electrical field a high doped surface layer is created. The technical process, successfully applied with phosphorus and with boron based dopants, is described. The properties of plasma-doped 100 mm diameter monocrystalline silicon solar cells are demonstrated.
Research Organization:
Siemens AG, Frankfurter Ring 152, D-8000 Munchen
OSTI ID:
5050689
Report Number(s):
CONF-840561-
Conference Information:
Journal Name: Conf. Rec. IEEE Photovoltaic Spec. Conf.; (United States)
Country of Publication:
United States
Language:
English