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Title: Thermal analyses of solvent-exposed poly(etheretherketone) (PEEK) composites

Conference ·
OSTI ID:5027345

Poly(etheretherketone) (PEEK) is a thermally stable, semicrystalline engineering thermoplastic resin which is used as a wire coating and as a fiberglass filled molding compound in Mound applications. Considerable characterization of its thermal, chemical, and crystalline structural properties has been done. The present study was undertaken, in order to determine the effect of solvents which could be encountered in normal processing of PEEK composites into Mound components on PEEK's physical, chemical and thermal properties.

Research Organization:
Monsanto Research Corp., Miamisburg, OH (USA). Mound
DOE Contract Number:
AC04-76DP00053
OSTI ID:
5027345
Report Number(s):
MLM-3390(OP); CONF-8609122-2; ON: DE87000923
Resource Relation:
Conference: 15. North American Thermal Analysis Society conference, Cincinnati, OH, USA, 21 Sep 1986; Other Information: Portions of this document are illegible in microfiche products
Country of Publication:
United States
Language:
English