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An engineering model to simulate the thermal response of electronic devices during pulsed Nd:YAG laser welding

Technical Report ·
DOI:https://doi.org/10.2172/474900· OSTI ID:474900
; ;  [1];  [2]
  1. Sandia National Labs., Albuquerque, NM (United States). Engineering Sciences Center
  2. Wilson Greatbatch Ltd., Clarence, NY (United States). Technology Dept.

A model is developed to predict the thermal response of real electronic devices during pulsed Nd:YAG laser welding. Modeling laser-part interaction requires incorporation of weld pool hydrodynamics, and laser-metal vapor and laser-surface interactions. Although important information can be obtained from these models, they are not appropriate for use in design of actual components due to computational limitations. In lieu of solving for these detailed physics, a simple model is constructed. In this model, laser-part interactions are accounted for through an empirically determined energy transfer efficiency which is developed through the use of modeling and experiments. This engineering model is appropriate since part thermal response near the weld pool and weld pool shape is not of interest here. Reasonable agreement between predictions and experimental measurements for welding of real components are indicated.

Research Organization:
Sandia National Labs., Albuquerque, NM (United States)
Sponsoring Organization:
USDOE, Washington, DC (United States)
DOE Contract Number:
AC04-94AL85000
OSTI ID:
474900
Report Number(s):
SAND--96-3027C; CONF-970616--5; ON: DE97001887
Country of Publication:
United States
Language:
English

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