STEM investigation of the chemistry and bonding changes associated with the grain boundary embrittlement of Cu by Bi
Conference
·
OSTI ID:468861
- Lehigh Univ., Bethlehem, PA (United States)
It has long been known that trace amounts of Bi can embrittle Cu after appropriate heat treatments. The Bi segregates to the grain boundaries and weakens them such that failure occurs through intergranular fracture without plastic deformation. This behavior is demonstrated in the scanning electron micrograph of a typical Cu-Bi fracture surface in Figure 1. It is known that the Bi extends for only a few atomic layers into the grains on either side of the grain boundary. This narrow segregation width was been confirmed using Energy Dispersive X-ray Spectroscopy (EDS) on a VG HB603 STEM. Figure 2 shows the ratio of Bi to Cu as the probe is stepped across the grain boundary.
- OSTI ID:
- 468861
- Report Number(s):
- CONF-960877--
- Country of Publication:
- United States
- Language:
- English
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