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Experimental study and modeling of thermal contact resistance across bolted joints

Journal Article · · Journal of Thermophysics and Heat Transfer
DOI:https://doi.org/10.2514/3.515· OSTI ID:45868
; ; ;  [1]
  1. IBM, Poughkeepsie, NY (United States)
A simple, closed-form model to predict thermal contact resistance of a bolted joint has been developed using a finite element analysis. The plates are of the same thickness and material. The plates are assumed to be smooth and flat. Experiments, using oxygen-free copper plates of various thickness, were performed to study the effects of various parameters on the bolted joint thermal resistance. The comparison between the predicted and the measured resistance shows good agreement. 16 refs.
Sponsoring Organization:
USDOE
OSTI ID:
45868
Journal Information:
Journal of Thermophysics and Heat Transfer, Journal Name: Journal of Thermophysics and Heat Transfer Journal Issue: 1 Vol. 8; ISSN 0887-8722; ISSN JTHTEO
Country of Publication:
United States
Language:
English

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