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Grain boundary studies of high temperature superconducting materials using electron backscatter Kikuchi diffraction

Conference ·
OSTI ID:448095

Grain Orientation and gain boundary misorientation distributions in high critical current density, high temperature superconductors were determined using electron backscatter Kikuchi diffraction. It is found that depending on the type of superconductor and the processing method used to fabricate it, there exist different scales of biaxial texture from no biaxial texture, local biaxial texture, to complete biaxial texture. Experimentally obtained grain boundary misorientation distributions (GBMDs) were found to be skewed significantly to low angles in comparison to what is expected on the basis of macroscopic texture alone, suggesting that minimization of energy may be a driving force during the processing of high critical current density materials. In addition, a higher than expected fraction of coincident-site lattice boundaries is observed. Examination of maps of grain boundary misorientations in spatially correlated gains, i.e. the grain boundary mesotexture, suggests the presence percolative paths of high critical current density. A combination of orientation measurements, theoretical modeling of GBMDs and modeling of percolative current flow through an assemblage of gain boundaries is performed to gain an insight into the important microstructural features dictating the transport properties of high temperature superconductors. It is found that maximization of low energy, in particular, low angle boundaries is essential for higher critical currents. The combination of experimental and analytical techniques employed are applicable to other materials where physical properties are dominated by interganular characteristics.

Research Organization:
Oak Ridge National Lab., TN (United States); Brookhaven National Lab., Upton, NY (United States)
Sponsoring Organization:
USDOE Assistant Secretary for Energy Efficiency and Renewable Energy, Washington, DC (United States)
DOE Contract Number:
AC05-96OR22464; AC02-76CH00016
OSTI ID:
448095
Report Number(s):
CONF-9606309--1; ON: DE97004305
Country of Publication:
United States
Language:
English