Dissolution rate measurements of TiN in Ti-6242

Journal Article · Wed Jan 01 04:00:00 EST 1997 · Acta Materialia

DOI:https://doi.org/10.1016/S1359-6454(96)00098-5· OSTI ID:445348

Bewlay, B P; Gigliotti, M F.X. ^[1]

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1. General Electric Co., Schenectady, NY (United States). Corporate Research and Development

This paper describes measurements of the dissolution rate of nitrided Ti sponge and monolithic TiN rod in molten Ti-6242. The dissolution rate is described in terms of an interface recession rate that was 2.2 {micro}m/s for a Ti-6242 temperature of 1,725 C and dissolution times between 1 and 100 min. Similar dissolution rates were measured for nitrided sponge and monolithic rod. This report also descries the microstructural and chemical interdiffusion phenomena that occur during dissolution of solid {delta}TiN in molten Ti-6242. There is a N-containing solid {alpha}Ti layer and a N-solidified {beta}Ti layer between the solid {delta}TiN and liquid Ti-6242 during dissolution. Microprobe measurements indicate that diffusion of Al, Zr, Sn and Mo into {delta}TiN did not occur. Steep N concentration profiles were observed in the {alpha}Ti layer. Al, Zr, Sn and Mo were observed in the N-solidified {beta}Ti layer contained <1% N. Similar microstructural and interdiffusional behaviors were observed during dissolution of nitrided sponge and monolithic {delta}TiN rod in molten Ti-6242.

• OSTI ID: 445348
• Journal Information: Acta Materialia, Journal Name: Acta Materialia Journal Issue: 1 Vol. 45; ISSN 1359-6454; ISSN ACMAFD
• Country of Publication: United States
• Language: English

Related Subjects

33 ADVANCED PROPULSION SYSTEMS
36 MATERIALS SCIENCE
AEROSPACE INDUSTRY
DIFFUSION
DISSOLUTION
EXPERIMENTAL DATA
INCLUSIONS
KINETICS
LIQUID METALS
MANUFACTURING
MICROSTRUCTURE
TITANIUM BASE ALLOYS
TITANIUM NITRIDES