Effect of triple junction on fatigue crack growth in copper and copper-3 at.% aluminium tricrystals

Journal Article · Sat Feb 15 04:00:00 EST 1997 · Scripta Materialia

DOI:https://doi.org/10.1016/S1359-6462(96)00393-4· OSTI ID:438624

Vinogradov, A ^[1]; Hashimoto, S ^[2]

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1. Kanazawa Univ. (Japan). Dept. of Mechanical Systems Engineering
2. Kyoto Univ. (Japan). Dept. of Engineering Physics and Mechanics

It has been well understood that many properties of polycrystals depend on both characteristics of grain boundaries (GBs) and triple junctions. Cu and Cu-Al belong to the most extensively studied group of metals in the field of fatigue in the last 20 years. However, triple junctions in these materials have been scarcely studied from the viewpoint of their mechanical properties and fatigue, in particular. The question of what effect the GB junction has on fatigue crack behavior in different materials remains unanswered. The bicrystals are widely used for examination of interfaces in materials, but they do not adequately represent the behavior of polycrystals. Tricrystals are believed to be most suitable for investigation of the structure and properties of triple junctions. The purpose of the present work is to examine the effect of triple junction on the fatigue crack behavior in Cu and Cu-Al tricrystals having adjoined {Sigma}3-{Sigma}3-{Sigma}9 boundaries of the same geometry.

• OSTI ID: 438624
• Journal Information: Scripta Materialia, Journal Name: Scripta Materialia Journal Issue: 4 Vol. 36; ISSN 1359-6462; ISSN SCMAF7
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
ALUMINIUM ALLOYS
COPPER
COPPER ALLOYS
CRACK PROPAGATION
FATIGUE
GRAIN BOUNDARIES
POLYCRYSTALS