Hot-gas solder leveling on printed circuit boards
Technical Report
·
OSTI ID:4376398
Hot-gas solder leveling on printed circuit boards produces a more uniform coating in the plated-through holes than other methods. while achieving an acceptable leveling of the lands. The amount of thermal degradation to the printed circuit board by the leveling process is reduced. The working environment of the leveling machine is improved by eliminating the contaminating vapors. (auth)
- Research Organization:
- Sandia Labs., Albuquerque, N.Mex. (USA)
- DOE Contract Number:
- AT(29-1)-789
- NSA Number:
- NSA-29-012482
- OSTI ID:
- 4376398
- Report Number(s):
- SLA-73-891
- Resource Relation:
- Other Information: Orig. Receipt Date: 30-JUN-74
- Country of Publication:
- United States
- Language:
- English
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