Thin-film microcircuit substrate metallization. Final report
A thin-film technique for applying gold over tantalum-nitridecoated alumina substrates was developed to permit thermocompression bonding of fine wires, beam-lead devices, and lead frames. Satisfactory gold adhesion was obtained by depositing a thin layer of chromium over the tantalum nitride before depositing the gold. The system provides guidelines for fabricating hybrid microcircuits that contain beam-lead devices. (auth)
- Research Organization:
- Bendix Corp., Kansas City, Mo. (USA)
- DOE Contract Number:
- AT(29-1)-613
- NSA Number:
- NSA-29-015101
- OSTI ID:
- 4357806
- Report Number(s):
- BDX--613-760(Rev.)
- Country of Publication:
- United States
- Language:
- English
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