EPOXY RESINS AS CRYOGENIC STRUCTURAL ADHESIVES
Technical Report
·
OSTI ID:4343034
An investigation of copper to copper bonds using filled epoxy resins an anhesives was undertaken to provide design data for a liquid H/sub 2/ cooled electromagnet. The anhesives studied were epoxy resin paste with liquid amine curing agent and 55% alumina as filler. (T.R.H.)
- Research Organization:
- National Bureau of Standards. Cryogenic Engineering Lab., Boudler, Colo.
- NSA Number:
- NSA-12-010357
- OSTI ID:
- 4343034
- Report Number(s):
- NBS-5039
- Resource Relation:
- Other Information: Orig. Receipt Date: 31-DEC-58
- Country of Publication:
- United States
- Language:
- English
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