Thermo-electric modular structure and method of making same
A method is presented for making a thermoelectric module wtth the aid of an insulating wafer having opposite metallized surfaces, a pair of similar equalizing sheets of metal, a hot-junction strap of metal, a thermoelectric element having hot- and cold-junction surfaces, and a radiator sheet of metal. The method comprises the following steps: brazing said equalizer sheets to said opposite metallized surfaces, respectively, of said insulating wafer with pure copper in a non-oxidizing ambient; brazing one surface of said hot-junction strap to one of the surfaces of said equalizing sheet with a nickel-gold alloy in a non- oxidizing ambient; and diffusion bonding said hot-junction surface of said thermoelectric element to the other surface of said hot-junction strap and said radiator sheet to said cold-junction surface of said thermoelectric element, said diffusion bonding being carried out in a non-oxidizing ambient, under compressive loading, at a temperature of about 550 deg C., and for about one-half hour. (Official Gazette)
- Research Organization:
- Originating Research Org. not identified
- NSA Number:
- NSA-29-024111
- Assignee:
- to United States Atomic Energy Commission
- Patent Number(s):
- US 3787958
- OSTI ID:
- 4338270
- Resource Relation:
- Patent File Date: 1965 Aug 18; Other Information: B23k31/02. Orig. Receipt Date: 30-JUN-74
- Country of Publication:
- United States
- Language:
- English
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