Defect Production and Migration In Copper and Nickel
- North American Aviation, Inc., Canoga Park, CA (United States). Atomics International Div.
The recovery of electrical resistivity change of high purity copper, nickel, and gold has been studied over a wide temperature range from 4.2 °K to 870 °K following electron irradiation and cold-work. The following was observed: 1) The electron damage rates for samples simultaneously irradiated below 15 °K were 10.6 x 10-27 ohm-cm per electron/cm2 in nickel and 3.6 x 10-27 ohm-cm per electron/cm2 in copper. 2) Copper, nickel and gold pulled at 4.2 °K have similar recovery characteristics up to 100 ° K, showing no sharp recovery stage (Stage I). 3) Copper and nickel irradiated by electrons near liquid air temperature show a sharp recovery stage (Stage III) at 25 °C in copper and 125 °C in nickel. These temperatures are equivalent on a reduced temperature scale using the melting temperatures as reference points. 4) Nickel cold worked at room temperature shows three recovery stages: Stage III at 80 °C, Stage IV at 275 °C, and Stage V beginning at 400 °C. The similarities between copper and nickel in these recovery stages is striking and allows one to make assignments for defect migration in both metals in corresponding temperature ranges.
- Research Organization:
- North American Aviation, Inc., Canoga Park, CA (United States). Atomics International Div.
- Sponsoring Organization:
- US Atomic Energy Commission (AEC)
- DOE Contract Number:
- AT(11-1)-GEN-8
- NSA Number:
- NSA-12-005737
- OSTI ID:
- 4338005
- Report Number(s):
- NAA-SR--2062
- Country of Publication:
- United States
- Language:
- English
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