IMAP: Interferometry for Material Property Measurement in MEMS
- Sandia National Laboratories
An interferometric technique has been developed for non-destructive, high-confidence, in-situ determination of material properties in MEMS. By using interferometry to measure the full deflection curves of beams pulled toward the substrate under electrostatic loads, the actual behavior of the beams has been modeled. No other method for determining material properties allows such detailed knowledge of device behavior to be gathered. Values for material properties and non-idealities (such as support post compliance) have then been extracted which minimize the error between the measured and modeled deflections. High accuracy and resolution have been demonstrated, allowing the measurements to be used to enhance process control.
- Research Organization:
- Sandia National Labs., Albuquerque, NM (US); Sandia National Labs., Livermore, CA (US)
- Sponsoring Organization:
- US Department of Energy (US)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 4275
- Report Number(s):
- SAND99-0586C
- Country of Publication:
- United States
- Language:
- English
Similar Records
Mechanical behavior simulation of MEMS-based cantilever beam using COMSOL multiphysics
Interferometric Measurement for Improved Understanding of Boundary Effects in Micromachined Beams